US Patent Issued to Sony Semiconductor Solutions on Dec. 30 for "Wiring structure, method of manufacturing the same, and imaging device" (Japanese Inventors)

ALEXANDRIA, Va., Dec. 31 -- United States Patent no. 12,514,017, issued on Dec. 30, was assigned to Sony Semiconductor Solutions Corp. (Kanagawa, Japan).

"Wiring structure, method of manufacturing the same, and imaging device" was invented by Koichi Sejima (Kanagawa, Japan), Takashi Fukatani (Kumamoto, Japan), Kenya Nishio (Kanagawa, Japan), Masaki Haneda (Kanagawa, Japan), Nobutoshi Fujii (Kanagawa, Japan) and Suguru Saito (Kanagawa, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "Provided is a semiconductor device with a wiring layer including a plurality of wiring lines extending in a first direction; a first insulating film stacked on the wiring layer that has a gap region between the plurality of w...