US Patent Issued to SONY SEMICONDUCTOR SOLUTIONS on Dec. 30 for "Solid-state imaging element and electronic device" (Japanese Inventors)

ALEXANDRIA, Va., Dec. 31 -- United States Patent no. 12,514,019, issued on Dec. 30, was assigned to SONY SEMICONDUCTOR SOLUTIONS Corp. (Kanagawa, Japan).

"Solid-state imaging element and electronic device" was invented by Shuhei Maeda (Kanagawa, Japan), Takashi Tanaka (Kanagawa, Japan) and Hironobu Fukui (Kanagawa, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A solid-state imaging element according to an aspect of the present disclosure includes a first semiconductor substrate (11), an insulating layer (46) and a second semiconductor substrate (21), a floating diffusion layer (FD) of the first semiconductor substrate (11), a transfer gate (TG) of the first semiconductor substrate (11), a first throug...