US Patent Issued to SONY SEMICONDUCTOR SOLUTIONS on Dec. 30 for "Semiconductor chip, manufacturing method for semiconductor chip, and electronic device" (Japanese Inventor)

ALEXANDRIA, Va., Dec. 31 -- United States Patent no. 12,514,014, issued on Dec. 30, was assigned to SONY SEMICONDUCTOR SOLUTIONS Corp. (Kanagawa, Japan).

"Semiconductor chip, manufacturing method for semiconductor chip, and electronic device" was invented by Taichi Natori (Kanagawa, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "Provided is a semiconductor chip that includes a solid-state imaging element and a cholesteric liquid crystal layer. The cholesteric liquid crystal layer is provided on a side from which light is incident with respect to the solid-state imaging element. The cholesteric liquid crystal layer is formed by cholesteric liquid crystal."

The patent was filed on Jan. 13, 2022, under A...