US Patent Issued to Sony Semiconductor Solutions on Dec. 23 for "Light emitting device and method of manufacturing light emitting device" (Japanese Inventor)

ALEXANDRIA, Va., Dec. 23 -- United States Patent no. 12,506,325, issued on Dec. 23, was assigned to Sony Semiconductor Solutions Corp. (Kanagawa, Japan).

"Light emitting device and method of manufacturing light emitting device" was invented by Takahiro Arakida (Kumamoto, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A light emitting device according to an embodiment of the present disclosure includes: a semi-insulating substrate having a first surface and a second surface that are opposed to each other; a first semiconductor layer that is stacked on the first surface of the semi-insulating substrate and has a lattice plane non-continuous to the semi-insulating substrate; and a semiconductor stacked bo...