ALEXANDRIA, Va., Dec. 16 -- United States Patent no. 12,501,126, issued on Dec. 16, was assigned to Sony Semiconductor Solutions Corp. (Kanagawa, Japan).
"Sensor module" was invented by Haruki Tanaka (Kanagawa, Japan).
According to the abstract* released by the U.S. Patent & Trademark Office: "[Object] To provide a sensor module that makes it possible to suppress generation of resin burrs and improve workability.[Solving Means] A sensor module (100) according to an embodiment of the present technology includes a sensor element, a first case (11), a second case (12), and a groove (70). The first case (11) includes an opening end including a first welded region and accommodates therein the sensor element. The second case (12) includes a joi...