US Patent Issued to SONY SEMICONDUCTOR SOLUTIONS on Aug. 5 for "Solid-state imaging element and electronic device" (Japanese Inventors)

ALEXANDRIA, Va., Aug. 6 -- United States Patent no. 12,382,741, issued on Aug. 5, was assigned to SONY SEMICONDUCTOR SOLUTIONS Corp. (Kanagawa, Japan).

"Solid-state imaging element and electronic device" was invented by Takayuki Tanaka (Kanagawa, Japan) and Tomohiko Baba (Kanagawa, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A dam region that blocks an outflow of a resin from a chip mounting region suppresses an influence of incident light. A solid-state imaging element is provided with a pixel region in which a plurality of pixels is arranged, and a chip mounting region in which a chip is mounted. Furthermore, a dam region that blocks an outflow of a resin from the chip mounting region is arranged ...