US Patent Issued to Sony Semiconductor Solutions on Aug. 26 for "Imaging device having a plurality of in-layer lenses with corresponding on-chip lenses" (Japanese Inventors)

ALEXANDRIA, Va., Aug. 26 -- United States Patent no. 12,402,427, issued on Aug. 26, was assigned to Sony Semiconductor Solutions Corp. (Kanagawa, Japan).

"Imaging device having a plurality of in-layer lenses with corresponding on-chip lenses" was invented by Hironari Otsuji (Kanagawa, Japan) and Hiroyuki Kawano (Kanagawa, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "The deterioration of the image quality of an imaging element is to be prevented.The imaging element includes an on-chip lens, a photoelectric conversion unit, and a plurality of in-layer lenses. The on-chip lens collects incident light from a subject. The photoelectric conversion unit performs photoelectric conversion on the collected inc...