US Patent Issued to Sony Semiconductor Solutions on April 22 for "Solid-state imaging device, manufacturing method thereof, and camera with alternatively arranged pixel combinations" (Japanese Inventors)

ALEXANDRIA, Va., June 6 -- United States Patent no. 12,284,840, issued on April 22, was assigned to Sony Semiconductor Solutions Corp. (Kanagawa, Japan).

"Solid-state imaging device, manufacturing method thereof, and camera with alternatively arranged pixel combinations" was invented by Hiroaki Ishiwata (Tokyo) and Sanghoon Ha (Kanagawa, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A solid-state imaging device includes a semiconductor substrate; and a pixel unit having a plurality of pixels on the semiconductor substrate, wherein the pixel unit includes first pixel groups having two or more pixels and second pixel groups being different from the first pixel groups, wherein a portion of the pixels in ...