US Patent Issued to Sony Semiconductor Solutions on April 22 for "Imaging element and distance measurement module" (Japanese Inventors)

ALEXANDRIA, Va., June 6 -- United States Patent no. 12,283,603, issued on April 22, was assigned to Sony Semiconductor Solutions Corp. (Kanagawa, Japan).

"Imaging element and distance measurement module" was invented by Hideki Arai (Kanagawa, Japan), Yusuke Otake (Kanagawa, Japan), Takuro Murase (Kanagawa, Japan) and Takeshi Yamazaki (Kanagawa, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "The present technique relates to an imaging element and a distance measurement module capable of reducing parasitic capacity. A distance measurement module includes: a first wiring that connects predetermined transistors in first adjacent pixels to a via formed in one of first adjacent pixels and connected to a wiri...