US Patent Issued to SONY SEMICONDUCTOR SOLUTIONS, SONY GROUP on March 25 for "Terminal and connection method" (British, Japanese Inventors)

ALEXANDRIA, Va., March 26 -- United States Patent no. 12,261,138, issued on March 25, was assigned to SONY SEMICONDUCTOR SOLUTIONS Corp. (Kanagawa, Japan) and SONY GROUP Corp. (Tokyo).

"Terminal and connection method" was invented by Jo Umezawa (Kanagawa, Japan), Matthew Lawrenson (London), Bernadette Elliott-Bowman (London), Christopher Wright (London) and Timothy Beard (London).

According to the abstract* released by the U.S. Patent & Trademark Office: "An object of the present technology is to prevent damage in a bonded portion between a semiconductor chip and a substrate in a semiconductor device in which the semiconductor chip is mounted on the substrate.A terminal is disposed between an electrode of an element and an electrode of a ...