US Patent Issued to SONY SEMICONDUCTOR SOLUTIONS, SONY GROUP on Dec. 16 for "Substrate and semiconductor package" (British, Japanese Inventors)

ALEXANDRIA, Va., Dec. 16 -- United States Patent no. 12,500,182, issued on Dec. 16, was assigned to SONY SEMICONDUCTOR SOLUTIONS Corp. (Kanagawa, Japan) and SONY GROUP Corp. (Tokyo).

"Substrate and semiconductor package" was invented by Hirohito Miyazaki (Kanagawa, Japan), Yuji Nishida (Kanagawa, Japan), Christopher Wright (London), Bernadette Elliott-Bowman (London) and Timothy Beard (London).

According to the abstract* released by the U.S. Patent & Trademark Office: "Damage to a joint part of a terminal of an electronic component mounted on a substrate is detected. The substrate includes a base material unit, a land, and a light detection unit. The land included in the substrate is arranged with a stress light emitting body configured t...