US Patent Issued to Sony on July 29 for "Resin composition and method of producing resin composition, and method of producing resin molding" (Japanese Inventors)

ALEXANDRIA, Va., July 30 -- United States Patent no. 12,371,564, issued on July 29, was assigned to Sony Corp. (Tokyo).

"Resin composition and method of producing resin composition, and method of producing resin molding" was invented by Akito Kuriyama (Kanagawa, Japan), Yasuhito Inagaki (Kanagawa, Japan), Kenji Ueda (Kanagawa, Japan) and Kohei Shimizu (Kanagawa, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "To provide a resin composition having excellent resin properties. Provided is a resin composition including: at least one thermoplastic resin (A); and a hydroxyl fatty acid ester (B) that are at least blended, in which when the weight-average molecular weight of the at least one thermoplastic resin...