US Patent Issued to SONY GROUP on Sept. 23 for "Spring expansion/compression mechanism, robot, and electronic device" (Japanese Inventors)

ALEXANDRIA, Va., Sept. 23 -- United States Patent no. 12,422,027, issued on Sept. 23, was assigned to SONY GROUP Corp. (Tokyo).

"Spring expansion/compression mechanism, robot, and electronic device" was invented by Kanako Kurokawa (Tokyo) and Nobuki Oshima (Tokyo).

According to the abstract* released by the U.S. Patent & Trademark Office: "A spring expansion/compression mechanism (SM) includes an outer ring (OR), a wire (WR), a spring (SP), and an outer-ring drive mechanism (RPT). The wire (WR) is connected to the outer surface of the outer ring (OR). The spring (SP) is connected to the outer ring (OR) via the wire (WR). The spring (SP) is compressed when the wire (WR) is wound around the outer ring (OR). The outer-ring drive mechanism (R...