US Patent Issued to Sony Group on Sept. 16 for "Semiconductor device and method of manufacturing the same, and electronic apparatus" (Japanese Inventors)

ALEXANDRIA, Va., Sept. 17 -- United States Patent no. 12,419,127, issued on Sept. 16, was assigned to Sony Group Corp. (Tokyo).

"Semiconductor device and method of manufacturing the same, and electronic apparatus" was invented by Taku Umebayashi (Kanagawa, Japan), Hiroshi Takahashi (Kanagawa, Japan) and Reijiroh Shohji (Nagasaki, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device is provided as a back-illuminated solid-state imaging device. The device is manufactured by bonding a first semiconductor wafer with a pixel array in a half-finished product state and a second semiconductor wafer with a logic circuit in a half-finished product state together, making the first semiconductor w...