US Patent Issued to Sony Group on Oct. 7 for "Semiconductor component and manufacturing method thereof" (Japanese Inventor)

ALEXANDRIA, Va., Oct. 8 -- United States Patent no. 12,439,630, issued on Oct. 7, was assigned to Sony Group Corp. (Tokyo).

"Semiconductor component and manufacturing method thereof" was invented by Koichi Amari (Kanagawa, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor component including: a semiconductor substrate; and a semiconductor device provided thereon, the device being a field-effect transistor that includes: a gate insulating film provided on the substrate; a gate electrode provided via the film; and a pair of source-drain regions provided to sandwich the electrode, the substrate including a patterned surface in a portion where the electrode is provided, the patterned surface o...