US Patent Issued to Sony Group on Oct. 21 for "Solid-state image pickup device, method of manufacturing solid-state image pickup device, and electronic apparatus" (Japanese Inventors)

ALEXANDRIA, Va., Oct. 28 -- United States Patent no. 12,453,201, issued on Oct. 21, was assigned to Sony Group Corp. (Tokyo).

"Solid-state image pickup device, method of manufacturing solid-state image pickup device, and electronic apparatus" was invented by Ryosuke Nakamura (Kanagawa, Japan), Fumihiko Koga (Kanagawa, Japan) and Taiichiro Watanabe (Kanagawa, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "There is provided a solid-state image pickup device including: a semiconductor substrate; a photodiode formed in the semiconductor substrate; a transistor having a gate electrode part or all of which is embedded in the semiconductor substrate, the transistor being configured to read a signal electric c...