US Patent Issued to Sony Group on May 20 for "Solid-state imaging device and method for manufacturing solid-state imaging device, and electronic device" (Japanese Inventors)

ALEXANDRIA, Va., June 16 -- United States Patent no. 12,310,130, issued on May 20, was assigned to Sony Group Corp. (Tokyo).

"Solid-state imaging device and method for manufacturing solid-state imaging device, and electronic device" was invented by Keiji Tatani (Kumamoto, Japan), Fumihiko Koga (Kanagawa, Japan) and Takashi Nagano (Kanagawa, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A solid-state imaging device includes a first-conductivity-type semiconductor well region, a plurality of pixels each of which is formed on the semiconductor well region and is composed of a photoelectric conversion portion and a pixel transistor, an element isolation region provided between the pixels and in the pixels...