US Patent Issued to Sony Group on May 13 for "Semiconductor device, fabrication process, and electronic device" (Japanese Inventor)

ALEXANDRIA, Va., June 12 -- United States Patent no. RE50,431, issued on May 13, was assigned to Sony Group Corp. (Tokyo).

"Semiconductor device, fabrication process, and electronic device" was invented by Masaya Nagata (Kanagawa, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device is provided, including a semiconductor substrate that includes a semiconductor; an electrode layer formed above a first surface side inside the semiconductor substrate; a conductor layer formed above the electrode layer and above the first surface of the semiconductor substrate; a hole formed through the semiconductor substrate from a second surface of the semiconductor substrate to the conductor layer; and...