US Patent Issued to Sony Group on March 18 for "Electronic component mounting substrate, electronic component mounted body, and method of manufacturing the same, as well as electronic apparatus" (Japanese Inventors)

ALEXANDRIA, Va., March 19 -- United States Patent no. 12,256,491, issued on March 18, was assigned to Sony Group Corp. (Tokyo).

"Electronic component mounting substrate, electronic component mounted body, and method of manufacturing the same, as well as electronic apparatus" was invented by Koji Aoyama (Aichi, Japan) and Naoto Sasaki (Aichi, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "An electronic component mounted body includes a substrate, a connection section provided on the substrate, an electronic component having a terminal connected to the connection section, and a solder that fixes the electronic component to the connection section. The connection section has a first region in which the ter...