US Patent Issued to Sony Group on June 24 for "Semiconductor device and method of manufacturing the same" (Japanese Inventors)

ALEXANDRIA, Va., June 25 -- United States Patent no. 12,342,615, issued on June 24, was assigned to Sony Group Corp. (Tokyo).

"Semiconductor device and method of manufacturing the same" was invented by Shinya Yamakawa (Kanagawa, Japan) and Yasushi Tateshita (Kanagawa, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device including, in cross section, a semiconductor substrate; a gate insulating film on the semiconductor substrate; a gate electrode on the gate insulating film, the gate electrode including a metal, a side wall insulating film at opposite sides of the gate electrode, the side wall insulating film contacting the substrate; a stress applying film at the opposite sides of the ...