ALEXANDRIA, Va., June 18 -- United States Patent no. RE50,457, issued on June 10, was assigned to Sony Group Corp. (Tokyo).
"Semiconductor device and semiconductor device manufacturing method" was invented by Yasushi Tateshita (Kanagawa, Japan).
According to the abstract* released by the U.S. Patent & Trademark Office: "In the present invention, there is provided a semiconductor device including: element isolation regions formed in a state of being buried in a semiconductor substrate such that an element formation region of the semiconductor substrate is interposed between the element isolation regions; a gate electrode formed on the element formation region with an gate insulating film interposed between the gate electrode and the elemen...