US Patent Issued to Sony Group on July 1 for "Semiconductor device, manufacturing method, solid state image sensor, and electronic equipment" (Japanese Inventor)

ALEXANDRIA, Va., July 3 -- United States Patent no. 12,347,798, issued on July 1, was assigned to Sony Group Corp. (Tokyo).

"Semiconductor device, manufacturing method, solid state image sensor, and electronic equipment" was invented by Masaki Haneda (Kanagawa, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "Connection pads are formed in interlayer films provided respectively in interconnection layers of a sensor substrate on which a sensor surface having pixels is formed and a signal processing substrate configured to perform signal processing on the sensor substrate to make an electrical connection between the sensor substrate and the signal processing substrate. Then, a metal oxide film is formed bet...