ALEXANDRIA, Va., Jan. 28 -- United States Patent no. 12,538,420, issued on Jan. 27, was assigned to Sony Group Corp. (Tokyo).
"Copper clad laminate and printed wiring board" was invented by Kenji Ueda (Tokyo), Fumikatsu Uesawa (Tokyo), Osamu Maki (Tokyo) and Yoshiyuki Nomura (Tokyo).
According to the abstract* released by the U.S. Patent & Trademark Office: "An object of the present technology is to provide a copper clad laminate including a resin substrate that has biodegradability and less likely to warp or crack. The present technology provides a copper clad laminate including: a resin substrate; an adhesive layer; and a copper foil layer, the adhesive layer and the copper foil layer being stacked in this order on at least one side of ...