US Patent Issued to Sony Group on Dec. 30 for "Solid-state imaging device having through electrode provided therein and electronic apparatus incorporating the solid-state imaging device" (Japanese Inventor)

ALEXANDRIA, Va., Dec. 31 -- United States Patent no. 12,514,020, issued on Dec. 30, was assigned to Sony Group Corp. (Tokyo).

"Solid-state imaging device having through electrode provided therein and electronic apparatus incorporating the solid-state imaging device" was invented by Hideaki Togashi (Kanagawa, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "There is provided a solid-state imaging device including: one or more photoelectric conversion elements provided on side of a first surface of a semiconductor substrate; a through electrode coupled to the one or more photoelectric conversion elements, and provided between the first surface and a second surface of the semiconductor substrate; and an amp...