US Patent Issued to Sony Group on Aug. 19 for "Semiconductor device, method of manufacturing a semiconductor device, solid-state imaging device, and electronic apparatus" (Japanese Inventors)

ALEXANDRIA, Va., Aug. 20 -- United States Patent no. 12,396,278, issued on Aug. 19, was assigned to Sony Group Corp. (Tokyo).

"Semiconductor device, method of manufacturing a semiconductor device, solid-state imaging device, and electronic apparatus" was invented by Hideaki Togashi (Kanagawa, Japan) and Kosuke Nakanishi (Kanagawa, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device of the present disclosure includes: a semiconductor element disposed on a first surface side of a semiconductor substrate; a through-electrode that is provided through the semiconductor substrate in a thickness direction of the semiconductor substrate and introduces charge obtained in the semiconductor elem...