ALEXANDRIA, Va., Dec. 31 -- United States Patent no. 12,508,678, issued on Dec. 30, was assigned to Sonplas GmbH (Straubing, Germany).
"Apparatus and method for cutting a film-like workpiece" was invented by Lars Weyh (Kunzell, Germany), Benedikt Schmuck (Bernried, Germany) and Florian Thalhofer (Langenneufnach, Germany).
According to the abstract* released by the U.S. Patent & Trademark Office: "The invention relates to an apparatus and a method for cutting a film-like workpiece, in particular an electrode sheet, by means of a laser beam with a clamping assembly for a sheet-shaped starting material. According to the invention it is provided that the clamping assembly comprises a first clamping plate device and a second clamping plate dev...