US Patent Issued to SONACA on Nov. 25 for "Optimized structure for regulating heat via heat pipe for electronic equipment support panels" (Belgian Inventors)

ALEXANDRIA, Va., Nov. 25 -- United States Patent no. 12,484,196, issued on Nov. 25, was assigned to SONACA S.A. (Gosselies, Belgium).

"Optimized structure for regulating heat via heat pipe for electronic equipment support panels" was invented by Barbara Mabed (Gosselies, Belgium) and Marc Bekemans (Charleroi, Belgium).

According to the abstract* released by the U.S. Patent & Trademark Office: "A profile section for an equipment support panel. The profile section is formed in one piece, comprising a tube suitable for forming a heat pipe by introducing and confining a heat-transfer fluid inside of same, and a groove provided to form a rail along its length for securing at least one piece of equipment supported by the panel, this groove bein...