ALEXANDRIA, Va., Sept. 30 -- United States Patent no. 12,428,553, issued on Sept. 30, was assigned to Solus Advanced Materials Co. Ltd. (Iksan, South Korea) and SEGI ENC Co. LTD. (Bucheon, South Korea).
"Resin composition" was invented by Hongsuk Kim (Yongin, South Korea), Chanwoo Kim (Yongin, South Korea) and Kijung Yang (Yongin, South Korea).
According to the abstract* released by the U.S. Patent & Trademark Office: "The present invention relates to a resin composition and an epoxy resin composition for display comprising the resin composition. More particularly, the present invention provides a transparent epoxy material that can be applied by various methods such as ink-jetting, dispensing, etc. to fill a gap by spraying a low-viscosi...