US Patent Issued to SOLID STATE STORAGE TECHNOLOGY on June 10 for "Protecting method for preventing solder crack failure in electronic product" (Taiwanese Inventors)

ALEXANDRIA, Va., June 18 -- United States Patent no. 12,328,827, issued on June 10, was assigned to SOLID STATE STORAGE TECHNOLOGY Corp. (Taipei, Taiwan).

"Protecting method for preventing solder crack failure in electronic product" was invented by Tsung-Lung Lin (Taipei, Taiwan), Kuan-Yu Chen (Taipei, Taiwan) and Yi-Chun Huang (Taipei, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A protecting method for preventing solder crack failure in an electronic product is provided. Firstly, a step (a) is performed to confirm that a crack incidence rate of a metallic solder material in a printed circuit board is high. In a step (b), a protecting mechanism of controlling the electronic product to enter an idle...