US Patent Issued to SOITEC on April 15 for "Method for manufacturing a substrate for a radiofrequency device" (French Inventors)

ALEXANDRIA, Va., June 5 -- United States Patent no. 12,278,608, issued on April 15, was assigned to SOITEC (Bernin, France).

"Method for manufacturing a substrate for a radiofrequency device" was invented by Djamel Belhachemi (Saint Martin d'Heres, France) and Thierry Barge (Bernin, France).

According to the abstract* released by the U.S. Patent & Trademark Office: "A process for fabricating a substrate for a radiofrequency device includes providing a piezoelectric substrate and a carrier substrate, depositing a dielectric layer on a surface of the piezoelectric substrate, assembling together the piezoelectric substrate and the carrier substrate with a polymerizable adhesive directly between the dielectric layer and the carrier substrate ...