US Patent Issued to Societe des Produits Nestle on Dec. 30 for "Recyclable cardboard packaging material comprising a metallized barrier layer applied by transfer metallization" (Swiss Inventors)

ALEXANDRIA, Va., Dec. 31 -- United States Patent no. 12,508,802, issued on Dec. 30, was assigned to Societe des Produits Nestle S.A. (Vevey, Switzerland).

"Recyclable cardboard packaging material comprising a metallized barrier layer applied by transfer metallization" was invented by Alexey Vishtal (Lausanne, Switzerland) and Johannes Zimmer (Lausanne, Switzerland).

According to the abstract* released by the U.S. Patent & Trademark Office: "The present invention concerns a paper-based barrier multilayer packaging material structure (1) being formed as a unitary sheet and comprising from its outer surface to its inner surface, the following layers: -a layer of water-based or solvent-less adhesive (6) having a thickness comprised between 1 ...