ALEXANDRIA, Va., Sept. 23 -- United States Patent no. 12,422,685, issued on Sept. 23, was assigned to Snap Inc. (Santa Monica, Calif.).
"Low pressure molded article and method for making same" was invented by Stephen Andrew Steger (Los Angeles).
According to the abstract* released by the U.S. Patent & Trademark Office: "An article includes a hollow enclosure defining a void. The void has a first section and a second section separate from the first section. An electronic component is housed in the first section and the second section of the void. A low pressure mold material is molded into the first section of the void and cured around a first segment of the electronic component to encapsulate the first segment of the electronic component....