US Patent Issued to Smiths Interconnect Americas on Jan. 28 for "Test socket for semiconductor integrated circuits" (California, Missouri, Texas Inventors)

ALEXANDRIA, Va., Jan. 29 -- United States Patent no. 12,210,036, issued on Jan. 28, was assigned to Smiths Interconnect Americas Inc. (Kansas City, Mo.).

"Test socket for semiconductor integrated circuits" was invented by Peter Ursu (San Ramon, Calif.), Jiachun Zhou (Grapevine, Texas), Siang Soh (Milpitas, Calif.) and Justin Bahaj (Kansas City, Mo.).

According to the abstract* released by the U.S. Patent & Trademark Office: "A test socket for an IC includes a socket body, a rotational contact, and an elastomer retainer. The socket body includes a top surface that faces the IC, and a bottom surface that faces a load board. The socket body defines a slot extending from the top surface to an aperture in the bottom surface. The rotational con...