US Patent Issued to SMARTFLEX TECHNOLOGY on Aug. 5 for "Articles of manufacture relating to IC modules and smart cards" (Singaporean Inventors)

ALEXANDRIA, Va., Aug. 6 -- United States Patent no. 12,380,311, issued on Aug. 5, was assigned to SMARTFLEX TECHNOLOGY PTE LTD (Singapore).

"Articles of manufacture relating to IC modules and smart cards" was invented by Eng Seng Ng (Singapore) and Sze Yong Pang (Singapore).

According to the abstract* released by the U.S. Patent & Trademark Office: "The present disclosure relates to carrier tapes, IC modules, and smart card devices. According to one embodiment, an article of manufacture comprises: a non-conductive substrate having a front side and a rear side, and a plurality of through holes extending from the front side to the rear side; a smart card contact area arranged on the front side of the substrate and having a plurality of cond...