US Patent Issued to Skyworks Solutions on Sept. 30 for "Methods related to dual-sided module with land-grid array (LGA) footprint" (California Inventors)

ALEXANDRIA, Va., Sept. 30 -- United States Patent no. 12,431,445, issued on Sept. 30, was assigned to Skyworks Solutions Inc. (Irvine, Calif.).

"Methods related to dual-sided module with land-grid array (LGA) footprint" was invented by Howard E. Chen (Anaheim, Calif.), Robert Francis Darveaux (Corona Del Mar, Calif.) and Anthony James Lobianco (Irvine, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "In some embodiments, a method for manufacturing packaged radio-frequency devices includes: providing a packaging substrate configured to receive a plurality of components, including a first side and a second side; mounting a first component on the first side of the packaging substrate; implementing a first ...