US Patent Issued to Skyworks Solutions on Sept. 16 for "Direct substrate to solder bump connection for thermal management in flip chip amplifiers" (American, Canadian Inventors)

ALEXANDRIA, Va., Sept. 17 -- United States Patent no. 12,418,265, issued on Sept. 16, was assigned to Skyworks Solutions Inc. (Irvine, Calif.).

"Direct substrate to solder bump connection for thermal management in flip chip amplifiers" was invented by Michael Joseph McPartlin (North Andover, Mass.), Bharatjeet Singh Gill (Ottawa) and Stephen Joseph Kovacic (Newport Beach, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "Solder bumps are placed in direct contact with the silicon substrate of an amplifier integrated circuit having a flip chip configuration. A plurality of amplifier transistor arrays generate waste heat that promotes thermal run away of the amplifier if not directed out of the integrated c...