US Patent Issued to Skyworks Solutions on Oct. 28 for "Temperature compensated acoustic wave device with multilayer interdigital transducer electrode including buffer layer" (Japanese, American Inventors)

ALEXANDRIA, Va., Oct. 28 -- United States Patent no. 12,456,960, issued on Oct. 28, was assigned to Skyworks Solutions Inc. (Irvine, Calif.).

"Temperature compensated acoustic wave device with multilayer interdigital transducer electrode including buffer layer" was invented by Takanori Yasuda (Nara, Japan), Keiichi Maki (Suita, Japan), Yumi Torazawa (Takatsuki, Japan), Rei Goto (Osaka, Japan) and Michael David Hill (Emmitsburg, Md.).

According to the abstract* released by the U.S. Patent & Trademark Office: "A temperature compensated surface acoustic wave device is disclosed. The temperature compensated surface acoustic wave device can include a piezoelectric layer, an interdigital transducer electrode over the piezoelectric layer, and a ...