US Patent Issued to Skyworks Solutions on Nov. 11 for "Substrate having a metal layer comprising a marking" (Japanese Inventors)

ALEXANDRIA, Va., Nov. 11 -- United States Patent no. 12,469,794, issued on Nov. 11, was assigned to Skyworks Solutions Inc. (Irvine, Calif.).

"Substrate having a metal layer comprising a marking" was invented by Atsushi Takano (Kadoma, Japan) and Mitsuhiro Furukawa (Nishinomiya, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method of marking information on a substrate for use in a semiconductor component is provided. The method comprises providing a substrate for use in a semiconductor component, providing a metal layer on a surface of the substrate, and providing a marking within the metal layer. A method of making a die, a radio-frequency module and a wireless mobile device; as well as a substrate...