US Patent Issued to Skyworks Solutions on Nov. 11 for "Packaged multilayer piezoelectric surface acoustic wave device with conductive pillar" (Japanese Inventors)

ALEXANDRIA, Va., Nov. 11 -- United States Patent no. 12,470,201, issued on Nov. 11, was assigned to Skyworks Solutions Inc. (Irvine, Calif.).

"Packaged multilayer piezoelectric surface acoustic wave device with conductive pillar" was invented by Hironori Fukuhara (Ibaraki, Japan), Rei Goto (Osaka, Japan) and Keiichi Maki (Suita, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A packaged surface acoustic wave device is disclosed. the packaged surface acoustic wave device can include a support substrate that includes a conductive via formed therein, a piezoelectric layer over the support substrate, an interdigital transducer electrode over the piezoelectric layer, a roof structure over the interdigital tr...