US Patent Issued to Skyworks Solutions on May 20 for "Method of manufacturing a cap substrate for acoustic wave device" (Singaporean, Japanese Inventors)

ALEXANDRIA, Va., June 16 -- United States Patent no. 12,308,811, issued on May 20, was assigned to Skyworks Solutions Inc. (Irvine, Calif.).

"Method of manufacturing a cap substrate for acoustic wave device" was invented by Wilfred Ryan Vidamo Habana (Singapore), Hidekazu Nakanishi (Sakai, Japan), XiaoJun Chew (Singapore) and Mitsuhiro Furukawa (Nishinomiya, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method for manufacturing a packaged acoustic wave component includes forming or providing a cap substrate, forming a metal layer on a surface of the cap substrate, marking the metal layer with one or more indicia and bonding the cap substrate to a device substrate that has an acoustic wave device on ...