ALEXANDRIA, Va., June 12 -- United States Patent no. 12,301,210, issued on May 13, was assigned to Skyworks Solutions Inc. (Irvine, Calif.).

"Method of making stacked acoustic wave resonator package with laser-drilled vias" was invented by Atsushi Takano (Kadoma, Japan), Mitsuhiro Furukawa (Nishinomiya, Japan) and Takeshi Furusawa (Toyonaka, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A packaged acoustic wave component is disclosed. The packaged acoustic wave component can include a first acoustic wave resonator that includes a first interdigital transducer electrode that is positioned over a first piezoelectric layer. The packaged acoustic wave component can also include a second acoustic wave reso...