US Patent Issued to Skyworks Solutions on March 25 for "Temperature compensated surface acoustic wave devices with multiple buried mass loading strips" (Japanese Inventor)

ALEXANDRIA, Va., March 26 -- United States Patent no. 12,261,591, issued on March 25, was assigned to Skyworks Solutions Inc. (Irvine, Calif.).

"Temperature compensated surface acoustic wave devices with multiple buried mass loading strips" was invented by Rei Goto (Osaka, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "An acoustic wave device comprises a substrate including a piezoelectric material, interdigital transducer (IDT) electrodes disposed on a surface of the substrate, a first dielectric film having a lower surface disposed on the IDT electrodes and the surface of the substrate, first strips formed of a first material having a density greater than a density of the first dielectric film dispos...