US Patent Issued to Skyworks Solutions on March 25 for "Application of conductive via or trench for intra module EMI shielding" (California Inventors)

ALEXANDRIA, Va., March 26 -- United States Patent no. 12,261,127, issued on March 25, was assigned to Skyworks Solutions Inc. (Irvine, Calif.).

"Application of conductive via or trench for intra module EMI shielding" was invented by Anthony James LoBianco (Irvine, Calif.), Hoang Mong Nguyen (Fountain Valley, Calif.), Matthew Sean Read (Foothill Ranch, Calif.), Howard E. Chen (Anaheim, Calif.), Ki Wook Lee (Irvine, Calif.) and Yi Liu (San Diego).

According to the abstract* released by the U.S. Patent & Trademark Office: "A packaged semiconductor module comprises a substrate having a ground plane, an electronic device mounted on a surface of the substrate, a bond pad disposed on the surface of the substrate and electrically connected to the...