ALEXANDRIA, Va., June 19 -- United States Patent no. 12,334,899, issued on June 17, was assigned to Skyworks Solutions Inc. (Irvine, Calif.).
"Acoustic wave devices on stacked die" was invented by Hiroyuki Nakamura (Osaka-Fu, Japan), Rei Goto (Osaka, Japan) and Keiichi Maki (Suita, Japan).
According to the abstract* released by the U.S. Patent & Trademark Office: "Aspects of this disclosure relate to acoustic wave devices on stacked die. A first die can include first acoustic wave device configured to generate a boundary acoustic wave. A second die can include a second acoustic wave device configured to generate a second boundary acoustic wave, in which the second die is stacked with the first die. The first acoustic wave resonator can in...