ALEXANDRIA, Va., July 9 -- United States Patent no. 12,356,545, issued on July 8, was assigned to Skyworks Solutions Inc. (Irvine, Calif.).
"High durability solder terminals" was invented by Yuji Yashiro (Kizugawa, Japan) and Toru Yamaji (Nagaokakyou, Japan).
According to the abstract* released by the U.S. Patent & Trademark Office: "An electronic device package includes a lower surface for conducting electronic signals, a first solder bond pad having a first size disposed on the lower surface, and a plurality of second solder bond pads having second sizes smaller than the first size disposed on the lower surface and surrounding the first solder bond pad."
The patent was filed on June 10, 2022, under Application No. 17/806,296.
*For fur...