US Patent Issued to Skyworks Solutions on July 8 for "Cap substrate for acoustic wave device" (Singaporean, Japanese Inventors)

ALEXANDRIA, Va., July 9 -- United States Patent no. 12,355,413, issued on July 8, was assigned to Skyworks Solutions Inc. (Irvine, Calif.).

"Cap substrate for acoustic wave device" was invented by Wilfred Ryan Vidamo Habana (Singapore), Hidekazu Nakanishi (Sakai, Japan), XiaoJun Chew (Singapore) and Mitsuhiro Furukawa (Nishinomiya, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A packaged acoustic wave component includes a device substrate and an acoustic wave device mounted on the device substrate. A peripheral wall is attached to the device substrate and surrounds the acoustic wave device. A cap substrate is attached to the peripheral wall and spaced above the device substrate. The cap substrate has ...