US Patent Issued to Skyworks Solutions on July 29 for "Method of manufacturing a self-shielded acoustic wave device package" (Japanese Inventors)

ALEXANDRIA, Va., July 30 -- United States Patent no. 12,375,057, issued on July 29, was assigned to Skyworks Solutions Inc. (Irvine, Calif.).

"Method of manufacturing a self-shielded acoustic wave device package" was invented by Atsushi Takano (Kadoma, Japan), Mitsuhiro Furukawa (Nishinomiya, Japan) and Takeshi Furusawa (Toyonaka, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method of manufacturing a packaged acoustic wave component includes forming or providing a cap substrate. The method also includes forming a metal shield plate on a surface of the cap substrate. The cap substrate is attached to a device substrate that has an acoustic wave device on a surface thereof such that the metal shield p...