US Patent Issued to Skyworks Solutions on July 29 for "Method for normalizing solder interconnects in a circuit package module after removal from a test board" (Iowa Inventors)

ALEXANDRIA, Va., July 30 -- United States Patent no. 12,376,236, issued on July 29, was assigned to Skyworks Solutions Inc. (Irvine, Calif.).

"Method for normalizing solder interconnects in a circuit package module after removal from a test board" was invented by James David Walling (Cedar Rapids, Iowa) and Jeffrey Sailer (Cedar Rapids, Iowa).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method for normalizing the solder interconnects (e.g., normalizing the height of the solder ball interconnects) in a circuit package module (e.g., dual-sided mold grid array package module) after removal from a test board includes receiving in a fixture the circuit package module upside down and removably coupling a stenci...