US Patent Issued to Skyworks Solutions on Jan. 13 for "Composited carrier for microphone package" (Japanese Inventors)

ALEXANDRIA, Va., Jan. 13 -- United States Patent no. 12,525,494, issued on Jan. 13, was assigned to Skyworks Solutions Inc. (Irvine, Calif.).

"Composited carrier for microphone package" was invented by Takanori Yasuda (Nara, Japan), Siarhei Dmitrievich Barsukou (Takarazuka, Japan), Keiichi Maki (Suita, Japan) and Hiroyuki Nakamura (Osaka-Fu, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "An integrated device package is disclosed. The integrated device package can include a carrier that has a multilayer structure having a first layer and a second layer. The first layer at least partially defines a lower side of the carrier. An electrical resistance of the second layer is greater than an electrical resis...