US Patent Issued to Skyworks Solutions on Dec. 16 for "Method of optimizing laser cutting of wafers for producing integrated circuit dies" (Mexican Inventors)

ALEXANDRIA, Va., Dec. 16 -- United States Patent no. 12,496,659, issued on Dec. 16, was assigned to Skyworks Solutions Inc. (Irvine, Calif.).

"Method of optimizing laser cutting of wafers for producing integrated circuit dies" was invented by Juan Arturo Jerez (Mexicali, Mexico), Miguel Camargo Soto (Mexicali, Mexico) and Luis Enrique Velazquez Cardenas (Mexicali, Mexico).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method for separating integrated circuit dies from a wafer includes making at least two cutting passes with a laser along a first die street of an integrated circuit die, the first die street extending along a first axis on the wafer. The method also includes making at least two cutting passes...